Optical emission components (TOSA):

Laser diode (LD) or light-emitting diode (LED): responsible for converting electrical signals into optical signals. LD is typically used for applications that require higher output power and narrower spectral width, while LED is suitable for lower cost, lower rate applications.

Driver circuit: Provide the required current or voltage to LD or LED to ensure stable light output.

Optical Receiver Assembly (ROSA):

Photodiode (PD) or avalanche photodiode (APD): converts the received optical signal into an electrical signal.

Pre amplifier: amplifies the weak electrical signal output by the photodiode for subsequent processing.

Metal packaging:

Shell: protects the internal optoelectronic devices from external environmental influences such as dust, humidity, and mechanical impacts.

Pin: used to connect with external circuits to achieve input and output of electrical signals.

Fiber optic interface:

Tail fiber: Connect the optical module to the fiber optic jumper to ensure smooth transmission of optical signals between the optical module and the fiber optic.

Connector: usually LC or SC type, used to connect tail fibers with other fiber optic devices or networks.

PCB board:

Circuit wiring: connecting optical emission components, optical reception components, and other functional circuits to achieve the conversion and transmission of electrical and optical signals.

Other functional circuits: may include temperature control, bias control, monitoring circuits, etc., to ensure the stability and reliability of the optical module.

In addition, depending on the specific type and application scenario of the optical module, it may also include some additional components and functions, such as temperature sensors, power monitoring, etc. These components and functions work together to ensure that the optical module can work stably and efficiently in various environments.