
Introduction of our company
We established in 2012 and creat our own brand in one year
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Core technology of the Gigac
Following customers' needs, shaping the soul of quality, igniting the flame of innovation, and shining as the leading beacon in global optical communications.
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Integrated Application of RF and Digital CircuitsGigac Technology integrates RF and microwave technologies into optical module design, and successfully develops an optical module that combines the strengths of microwave and digital circuits, with excellent signal quality and strong anti - interference ability.
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Patent for an excellent algorithmA patented algorithm that achieves millisecond-level rapid control response technology, providing more precise control of current and temperature, and ensuring a more stable operating state of the module.
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Low-Power Consumption TechnologyIn partnership with a renowned chip company, we have integrated radio frequency amplification technology into chip design, resulting in higher driving capability and energy conversion efficiency. Our company holds the exclusive right to use this technology for a period of five years.
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High-efficiency Light Chip TechnologyPatented technology of Gigac Technology, utilizing innovative processes and light-emitting architectures, results in lower energy consumption, more stable light emission, and extended product lifespan.
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Sensitivity Optimization TechnologyUtilizing the latest sensitivity optimization technology, the product's sensitivity has been enhanced by over 20%.
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Low-Speed Sensitive Signal Processing TechniqueThe low-speed sensitive signal processing technique is designed to handle the transmission of sensitive signals that require low jitter and low latency.
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Antistatic Design TechnologySupports low bit error rates under Level 4 electrostatic discharge (ESD) impacts, ensuring uninterrupted communication.
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New Heat Dissipation TechnologyUtilizing a combined heat dissipation method of thermal conduction and thermal radiation, it reduces module power consumption and achieves better heat dissipation effects.